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Burn In system
Optical chip reliability test solution
ATE Test System
Third generation compound semiconductor reliability test solution
Integrated circuit chip reliability test solution
Precision Fixture & Automation Calibration System
Memory chip reliability test solution
Optical Chips Foundry Service
Silicon optical testing and coupling solutions
Reliability equipment
test equipment
Coupling device
Loading and unloading equipment
AOI equipment
Automatic loading and unloading
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Optoelectronic field
CATEGORIES
Burn In system
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Burn-in system for high power logic device
Burn-in system for low power logic device
SiC wafer Burn-in system
Optical chip reliability testing system
Optical chip reliability test solution
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photo-communication
optical sensing
lightshow
laser processing
laser radar
ATE Test System
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Third generation compound semiconductor reliability test solution
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Silicon carbide wafer level reliability
Silicon carbide chip level test
Optoelectronic field
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wafer
Die/Bar
COC
Box/TO/COB
Module
Integrated circuit chip reliability test solution
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Car-scale MCU chip
SoC and FPGA
Complex Soc
Big power chip
Big power chip
Big power chip
Automatic loading and unloading machine
Precision Fixture & Automation Calibration System
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Memory chip reliability test solution
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NAND chip
D-RAM chip
Automatic loading and unloading machine
Optical Chips Foundry Service
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Silicon optical testing and coupling solutions
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Reliability equipment
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Wafer-level reliability system
COC Burn-in system
TO Burn-in system
COB Burn-in system
PIC Burn-in system
Device Burn-in system
test equipment
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Wafer level test equipment
Wafer level test equipment
Wafer level test equipment
chip test equipment
chip test equipment
chip test equipment
chip test equipment
Device test equipment
Coupling device
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Silicon optical test and coupling equipment
Loading and unloading equipment
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Device
COC
AOI equipment
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Automatic loading and unloading
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LATEST NEWS
[Welcome] The packaging and testin
Overview of Funds Related to the S
Report from Chinese Academy of Eng
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CONTACT US
Contact: Mr Liu
Phone: 18688779380
Tel: 18688779380
Email: eric.liu@feedlitech.com
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