FLT B9611 - copy

CATEGORIES

• Burn In system+
  • Burn-in system for high power logic device
  • Burn-in system for low power logic device
  • SiC wafer Burn-in system
  • Optical chip reliability testing system
• Optical chip reliability test solution+
  • photo-communication
  • optical sensing
  • lightshow
  • laser processing
  • laser radar
• ATE Test System+
• Third generation compound semiconductor reliability test solution+
  • Silicon carbide wafer level reliability
  • Silicon carbide chip level test
• Optoelectronic field+
  • wafer
  • Die/Bar
  • COC
  • Box/TO/COB
  • Module
• Integrated circuit chip reliability test solution+
  • Car-scale MCU chip
  • SoC and FPGA
  • Complex Soc
  • Big power chip
  • Big power chip
  • Big power chip
  • Automatic loading and unloading machine
• Precision Fixture & Automation Calibration System+
• Memory chip reliability test solution+
  • NAND chip
  • D-RAM chip
  • Automatic loading and unloading machine
• Optical Chips Foundry Service+
• Silicon optical testing and coupling solutions+
• Reliability equipment+
  • Wafer-level reliability system
  • COC Burn-in system
  • TO Burn-in system
  • COB Burn-in system
  • PIC Burn-in system
  • Device Burn-in system
• test equipment+
  • Wafer level test equipment
  • Wafer level test equipment
  • Wafer level test equipment
  • chip test equipment
  • chip test equipment
  • chip test equipment
  • chip test equipment
  • Device test equipment
• Coupling device+
  • Silicon optical test and coupling equipment
• Loading and unloading equipment+
  • Device
  • COC
• AOI equipment+
• Automatic loading and unloading+